The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Dec. 07, 2000
Tsukasa Yoda, Nagano, JP;
Hiroo Okubo, Nagano, JP;
Nissei Plastic Industrial Co., Ltd., Nagano-Ken, JP;
Abstract
A mold clamping apparatus of an injection molding machine is equipped with a drive mechanism for opening, closing, and clamping a mold. The drive mechanism includes a first drive mechanism portion including a first drive motor portion and a first ball-screw mechanism portion and advancing and retracting a movable platen in order to effect high-speed mold opening/closing operation; a second drive mechanism portion including a second drive motor portion and a second ball-screw mechanism portion and pressing a pressure platen in order to effect high-pressure mold clamping operation; and a clutch mechanism for connecting the pressure platen to the movable platen in a pressure applicable manner when the movable platen is located at a mold close position. The first drive mechanism portion advances and retracts the movable platen in order to effect high-speed mold opening/closing operation. When the movable platen has reached the mold close position (when the mold has been closed), the clutch mechanism connects the pressure platen to the movable platen. Subsequently, the second drive mechanism portion advances the pressure platen in order to apply pressure to the movable platen via the clutch mechanism, thereby effecting high-pressure mold clamping.