The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
May. 17, 2001
Takao Shimizu, Nagoya, JP;
Hirotsugu Horio, Nagoya, JP;
Kazushige Kito, Nagoya, JP;
Shigeyuki Inagaki, Nagoya, JP;
Ryuzo Yamada, Nagoya, JP;
Abstract
In diffusion bonding a metal pipe and a metal pipe via a bonded interface formed at the end parts, a portion that is inclined with respect to the radial direction of metal pipes and is provided at least at part of bonded interface In this case, the inclination angle &phgr; of bonded interface and the tip angle 2&thgr; of a pipe expansion tool are preferably in the relationship, 0<&phgr;≦&thgr;+60°. In performing pipe expansion of such a metal pipe bonded body the pipe expansion tool is moved from the metal pipe at which the inclined portion of junction face is formed to have a protruding shape, towards the metal pipe at which the inclined portion of junction face is formed to have a recessed shape. Furthermore, the inner diameter at the vicinity of the junction face of the metal pipe junction may be made larger than the inner diameter at positions away from the junction face.