The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Apr. 17, 2000
Applicant:
Inventor:
Koichi Kamoi, Wako, JP;
Assignee:
Gradco (Japan) Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 2/714 ;
U.S. Cl.
CPC ...
B65D 2/714 ;
Abstract
Mailing envelopes are made by using standard paper sizes with prescribed folds and application of adhesive. In one form, the envelope is of a horizontal configuration to receive a letter typical in countries like the United States of America and in another configuration, the envelope is more typical of envelopes for receiving a letter in countries like Japan.
Kamoi, Koichi. (2003). Mailing envelopes and a method of making same using standard paper sizes and a method of stuffing same (U.S. Patent No. 6592022). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6592022
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile