The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Feb. 13, 2002
Cheng-Hong Lee, Shinjuang, TW;
Hsin-Li Lee, Hsinchu, TW;
Industrial Technology Research Institute, Hsin Chu, TW;
Abstract
A device for bump probing and a method for fabricating the device are described. The device utilizes a bimorph-structured fingers for holding onto a solder bump, or a solder ball, without causing damages to the ball. The device further utilizes a direct current to cause an electrostatic force to flatten the probe fingers prior to attaching the fingers to a solder ball and for positioning the finger over a solder ball. After the electrostatic force is removed by disconnecting the direct current from the electrodes, the fingers grip onto the solder ball making electrical connection and performing testing. The invention further provides a micro-electro-mechanical-system technique for fabricating the probing device on a semiconducting substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile