The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Oct. 11, 2000
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/1301 ; H01L 2/146 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/1301 ; H01L 2/146 ;
Abstract
A method for manufacturing a semiconductor device having a heat dissipating layer including forming first separation grooves in a front surface of the semiconductor substrate; forming second separation grooves at bottoms of the first separation grooves; forming a linkage metal layer in the second semiconductor grooves; and cutting the linkage metal layer using laser light. According to this method, the top of the linkage metal layer is spaced from the surface of the semiconductor substrate and thus short-circuiting between the linkage metal layer and wires is avoided.