The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Jul. 09, 2001
David Weston Haggart, Jr., Scottsdale, AZ (US);
John Maltabes, Austin, TX (US);
Karl Emerson Mautz, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Chemical mechanical polishing (CMP) a metal film ( ) at the surface of a substrate ( ), with mixing a slurry precursor ( ) with an oxidizing agent ( ) to provide a slurry ( ) with a predetermined agent concentration, and supplying the slurry to a CMP pad ( ) to polish the film at a predetermined polishing rate is modified by altering the agent concentration at the end of polishing. Since the polishing rate is reduced, endpointing is enhanced. The concentration is altered by adding further oxidizing or reducing agents.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile