The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2003

Filed:

Feb. 27, 2001
Applicant:
Inventors:

Yoshitaka Kamo, Tokyo, JP;

Hiroaki Tosa, Tokyo, JP;

Tatsushi Higashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/122 ;
U.S. Cl.
CPC ...
H01R 1/122 ;
Abstract

There are provided an electric contact device for establishing reliable contact with ball contactors or strip contactors of a semiconductor device over contact areas of great area; a semiconductor device test socket using the electric contact device; a semiconductor module using the electric contact device; and a semiconductor device test method. A contact lead having a ring-shape or helical section is provided between a support pole and a movable pole. The movable pole is moved, to thereby bring the contact lead into an expanded state in which the diameter of the ring-shape or helical section becomes larger. A contactor is inserted into the ring-shape or helical section. The contact lead is then brought into a contacted state such that the diameter of the ring-shape or helical section becomes smaller, wherewith the contact lead is wrapped around the periphery of the contactor.


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