The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2003

Filed:

Jun. 25, 2001
Applicant:
Inventors:

Jy-An Wang, Oak Ridge, TN (US);

Kenneth C. Liu, Oak Ridge, TN (US);

Assignee:

UT-Battelle, LLC, Oak Ridge, TN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 3/26 ; G01N 1/908 ;
U.S. Cl.
CPC ...
G01N 3/26 ; G01N 1/908 ;
Abstract

A method for determining fracture toughness K of materials ranging from metallic alloys, brittle ceramics and their composites, and weldments. A cylindrical specimen having a helical V-groove with a 45° pitch is subjected to pure torsion. This loading configuration creates a uniform tensile-stress crack-opening mode, and a transverse plane-strain state along the helical groove. The full length of the spiral groove is equivalent to the thickness of a conventional compact-type specimen. K values are determined from the fracture torque and crack length measured from the test specimen using a 3-D finite element program (TOR3D-KIC) developed for the purpose. In addition, a mixed mode (combined tensile and shear stress mode) fracture toughness value can be determined by varying the pitch of the helical groove. Since the key information needed for determining the K value is condensed in the vicinity of the crack tip, the specimen can be significantly miniaturized without the loss of generality.


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