The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2003
Filed:
Aug. 01, 2000
Bun Chay Te, Singapore, SG;
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A mandrel for electroforming non-uniformly thick orifice plates and a method of making the mandrel are disclosed. The orifice plates have a thicker border surrounding a thinner orifice area. The mandrel has a metallic layer on a substrate. The metallic layer has a first molding surface that is electrically isolated from a second molding surface. The first and second molding surfaces are for substantially electroforming the border and the orifice area respectively. The mandrel also has dielectric areas patterned on the metallic layer for electroforming orifices in the orifice area. In use, the first molding surface is used to first electroform the border without electroforming the orifice area. As the border builds up, it electrically connects the first and the second molding surfaces to allow the second molding surface to subsequently electroform the orifice area.