The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 01, 2003

Filed:

Dec. 11, 1997
Applicant:
Inventors:

Yoshikatsu Yamamoto, Nagano, JP;

Takaichi Wada, Nagano, JP;

Nagamitsu Takashima, Nagano, JP;

Motonori Okumura, Nagano, JP;

Kazuhiko Hara, Nagano, JP;

Yuji Tanaka, Nagano, JP;

Takahiro Katakura, Nagano, JP;

Kohji Watanabe, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 5/376 ; C03B 2/900 ;
U.S. Cl.
CPC ...
B21D 5/376 ; C03B 2/900 ;
Abstract

A method of manufacturing an ink-jety recording head in which an ink supply port forming substrate , a common ink chamber forming substrate , and a nozzle plate are bonded together by inserting between them thermally fusible films and respectively, in which are formed through holes and at two or more positions, and by also filling the film through holes with an adhesive that is mixed with a gap material G for adjusting the thicknesses of the thermally fusible films when they are fused, so as to form a flow path unit ; and then the flow path unit and the actuator units are bonded together by inserting between them a thermally fusible film , in which are through holes at two or more positions, and by also filling the through holes with an adhesive that is mixed with a gap material G for adjusting the thickness of the thermally fusible film when it is fused.


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