The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2003

Filed:

Sep. 19, 2000
Applicant:
Inventor:

David L. Hall, Salt Lake City, UT (US);

Assignee:

Iomega Corporation, Roy, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/60 ; G11B 1/732 ;
U.S. Cl.
CPC ...
G11B 5/60 ; G11B 1/732 ;
Abstract

An improved head assembly having air bearing features for contaminant control in flexible media high contact-pressure zone. The head assembly having one or more air bearing features for improving the performance of the heads by controlling a flow of contaminants away from the head sensor and the high contact-pressure zone. The improved head assembly having air bearing features allows the head to keep contaminants out of the high contact-pressure zone proximate the head disk interface where the sensor communicates (e.g., contacts) the flexible media. The head assembly of the present invention includes a shaped slot air bearing feature formed in the rail having the sensor that directs the flow of contaminants away from the high contact-pressure zone and therefore, away from the sensor. This helps to prevent problems associated with head spacing and also damage to the head, the disk, and/or both. In addition, the present invention can also include an additional shaped slot air bearing feature positioned by the sensor. In another embodiment of the present invention, the head assembly has a shaped rail air bearing feature for controlling a flow of contaminants from entering the high contact-pressure zone and away from the sensor.


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