The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2003

Filed:

Oct. 04, 2001
Applicant:
Inventors:

Masamoto Tago, Tokyo, JP;

Yoshihiro Tomita, Tokyo, JP;

Kenji Takahashi, Ibaraki, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract

A semiconductor device includes a semiconductor chip. A substrate is arranged in opposition to the semiconductor chip. A first electrode is placed on the semiconductor chip while a second electrode is placed on the substrate. Each of the first and second electrodes is made of the same electrode material. An intermetallic compound layer is formed between the first electrode and the second electrode. The intermetallic compound layer is entirely a binary alloy of the electrode material and a bonding material that was applied to at least one of the first and second electrodes.


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