The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2003

Filed:

Dec. 19, 2001
Applicant:
Inventors:

Peter Joseph Sinkunas, Canton, MI (US);

Zhong-You (Joe) Shi, Ann Arbor, MI (US);

Jay D. Baker, Dearborn, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/005 ;
U.S. Cl.
CPC ...
B23K 1/005 ;
Abstract

A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.


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