The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2003
Filed:
Dec. 18, 2001
Applicant:
Inventors:
Noriyuki Ota, Tokyo, JP;
Nobuyuki Katsuki, Tokyo, JP;
Assignee:
NEC Electronics Corporation, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract
When a top surface area for a plurality of dummy patterns and a width for a plurality of trenches are set on the basis of a ratio (an occupation density of the film for polishing in an adjacent region ) of a total top surface area for raised sections of the film for polishing to a horizontally projected area of the adjacent region it is possible to suppress dishing and erosion and thereby attain a high planarity when a film for polishing is formed on a semiconductor substrate, wherein dummy patterns partitioned by a plurality of trenches are disposed in an element isolation region and planarization by the CMP is applied thereto.