The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6582223 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 24, 2003

Filed:

Nov. 23, 2001
Applicant:
Inventors:

Hiroshi Yasumura, Nara, JP;

Tadayuki Into, Tenri, JP;

Noriki Iwasaki, Nara, JP;

Yasuhiro Goto, Okayama, JP;

Tatsuyuki Ishioka, Fukuyama, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D 5/00 ;
U.S. Cl.
CPC ...
F27D 5/00 ;
Abstract

A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.


Find Patent Forward Citations

Yasumura, Hiroshi. (2003). Pickup apparatus for semiconductor chips (U.S. Patent No. 6582223). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6582223

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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