The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2003

Filed:

Aug. 31, 2001
Applicant:
Inventors:

Tadayoshi Takahara, Aichi-ken, JP;

Jun Chen, Toyota, JP;

Yoshio Sugimoto, Yokosuka, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 1/100 ; G01D 1/16 ;
U.S. Cl.
CPC ...
G01N 1/100 ; G01D 1/16 ;
Abstract

A method for analyzing creep characteristic of a plastic molded substance is provided wherein the creep characteristic can be analyzed of an actual plastic molded substance having various shape and fastening conditions with high precision. The main stress value for each section of the analysis target is read out, hydrostatic stress &sgr; of each section is calculated from the main stress value, and the stress condition is determined to be tensile stress when &sgr; is positive and to be compressive stress when &sgr; is negative. Tensile or compressive characteristic value is assigned based on the stress condition at each section, and creep is calculated for a predetermined time period based on the characteristic value. By employing characteristic values depending on the stress conditions of each section, precision of creep characteristic analysis is greatly enhanced.


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