The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2003
Filed:
Nov. 13, 2001
Applicant:
Inventors:
Ming-Tung Shen, Taipei City, TW;
I-Ming Chen, Taipei City, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A method for manufacturing a semiconductor device includes the steps of forming a hardened photoresist layer on a bonding pad of a semiconductor chip, forming a conductive layer on the hardened photoresist layer to form a conductive bump on the bonding pad, forming a plurality of supporting pads on the semiconductor chip, attaching a chip-mounting substrate on the semiconductor chip such that the supporting pads interconnect the semiconductor chip and the substrate, and forming an insulating layer that fills a space between the semiconductor chip and the substrate and that encloses the conductive bump.