The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2003
Filed:
Nov. 16, 2000
Applicant:
Inventor:
Inderjit Singh, San Jose, CA (US);
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 ; H05K 7/02 ; H01L 2/3498 ;
U.S. Cl.
CPC ...
H05K 1/14 ; H05K 7/02 ; H01L 2/3498 ;
Abstract
A flip-chip with a solder pre-plated leadframe that includes locating holes. The leadframe does not include a die attach pad. Two of the leads include a locating or alignment hole for receiving a solder bump of the bumped die. The remaining leads include die contact areas for placement of the die thereon with the solder bumps contacting the die contact areas. The leads with the die contact areas are downset. The downset is approximately 4 mm.