The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6579745 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 17, 2003

Filed:

Mar. 09, 2001
Applicant:
Inventors:

Yumi Sanaka, Kanagawa, JP;

Isamu Nakao, Tokyo, JP;

Tadashi Ishibashi, Kanagawa, JP;

Katsuya Shirai, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/148 ;
U.S. Cl.
CPC ...
H01L 2/148 ;
Abstract

Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.


Find Patent Forward Citations

Sanaka, Yumi. (2003). Method for mounting chips on board using magnetic positioning (U.S. Patent No. 6579745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6579745

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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