The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2003
Filed:
Jul. 25, 2000
Michael C. Cook, Marietta, GA (US);
Kimberly-Clark Worldwide, Inc., Neenah, WI (US);
Abstract
A extruded filament die tip, such as meltblown filaments, has a plurality of bores communicating with the main polymer distribution channel. The bores have a plurality of capillary openings, or spinnerettes, drilled into the bore to act as extrusion orifices for the die tip. The present die tip differs from conventional die tips in which capillaries are drilled into a deep slot formed in the die tip for polymer distribution. The invention allows more material to remain in the body of the die tip while facilitating more spinnerette openings per linear inch in the die tip and permitting higher operating pressures and smaller diameter fibers such as between 1 and 4 microns. A resultant nonwoven fabric made with the die tip will have a higher hydrohead resistance due to the increased number of fine filaments per inch for the same osy of fabric.