The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2003

Filed:

Nov. 14, 2001
Applicant:
Inventors:

Masahito Imai, Chita, JP;

Takeshi Shinoda, Kariya, JP;

Yasutoshi Suzuki, Okazaki, JP;

Hiroaki Tanaka, Kariya, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/04 ;
U.S. Cl.
CPC ...
G01L 9/04 ;
Abstract

A semiconductor sensor chip mounted on a thin diaphragm of a cylindrical metallic stem via an insulation layer is hermetically contained in a housing of a pressure sensor. The sensor chip includes a strain gage for outputting an electrical signal according to distortion of the diaphragm caused by pressure to be measured. A shield layer is interposed between the insulation layer and the sensor chip, and the shield layer is grounded. Influence of outside noises on the sensor outputs is eliminated or suppressed by the grounded shield layer even if the outside noises are in a high frequency region.


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