The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2003

Filed:

Nov. 05, 1999
Applicant:
Inventors:

Carl A. Benevit, Whitehall, PA (US);

Shane S. Dias, late of Allentown, PA (US);

John Anthony Pantone, Birdsboro, PA (US);

Matthew M. Moucheron, Allentown, PA (US);

John Michael Sharpe, Allentown, PA (US);

Assignee:

Agere Systems Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/750 ;
U.S. Cl.
CPC ...
G06F 1/750 ;
Abstract

A process for evaluating and correcting virtual integrated circuit designs includes a method and apparatus for determining a ratio of an amount of material, i.e. polysilicon or metal, in any given layer to an area of the layer. The ratio is then compared to a predetermined target ratio, which is based on a ratio of the total amount of the material to the entire area of the I-C design. The process then automatically inserts or deletes an amount of material from the layer as needed, using any of four methods. These methods include deletion, scaling, deletion and scaling or striping. The ratio for an erroneous layer is rechecked after the first correction is performed and the entire process is repeated using a Newton-Raphson or a Least Absolute Deviation Regression method until the ratio falls within the predetermined tolerances. If the layer has been filled, the layer is further checked for short circuits, fill isolation violations, antenna violations and the like which may have resulted from the material fill. The evaluation and correction process proceeds for each layer of the virtual integrated circuit design until the entire design has been evaluated and corrected.


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