The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2003
Filed:
Nov. 01, 2001
Junichi Hamatani, Matsumoto, JP;
Hisato Oshima, Takefu, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component includes an internal conductor (conductor coil) made of a metal that is embedded in a molded body. The molded body is formed by molding a ferrite resin into a fixed shape, such that at least a portion of the internal conductor is exposed on the surface of the molded body, and external electrodes, which are connected to the internal conductor, are provided in a fixed area, including the exposed portion of the internal conductor, on the surface of the molded body. The electronic component is manufactured by depositing palladium at a density of about 0.5 &mgr;g/cm to about 1.5 &mgr;g/cm in the area in which the internal conductor is not exposed on the molded body, and at a density of about 0.05 &mgr;g/cm to about 0.3 &mgr;g/cm on the internal conductor exposed on the surface of the molded body. The external electrodes are formed via a process of forming a metal film (electroless plating film) on the surface of the molded body by conducting electroless plating.