The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2003

Filed:

Apr. 26, 2001
Applicant:
Inventor:

Takashi Ishii, Shizuoka-ken, JP;

Assignee:

Yazaki Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/00 ;
U.S. Cl.
CPC ...
H01R 4/00 ;
Abstract

At least two coated electric wires W and W are superposed. Resin chips and are disposed above and below the superposed connection portion S. These resin chips and have been compressed from above and below and ultrasonic vibration has been applied thereto, thereby melting resin coats in the coated electric wires W and W to pressure weld conductive wires . The resin chips and and the resin coats have been melted and joined to each other, and the resin chips and have also been joined to each other by melting. A pair of resin sealings are provided between the upper resin chip and the coated electric wires W and W and between the lower resin chip and the coated electric wires W and W . Each resin sealing has rubber elasticity and is formed such as to annularly surround conductive wires , which are exposed from the resin coats and pressure welded.


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