The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2003

Filed:

May. 31, 2001
Applicant:
Inventors:

Hideto Kuramochi, Yokohama, JP;

Satoshi Kondoh, Yokohama, JP;

Yoshinori Harada, Sagamihara, JP;

Mutsumi Asano, Sagamihara, JP;

Assignee:

Tosoh Corporation, Yamaguchi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 1/100 ;
U.S. Cl.
CPC ...
B24D 1/100 ;
Abstract

An abrasive molding comprising at least 90% by weight, based on the abrasive molding, of an inorganic material having a stock hardness of 50-400 kg/mm , and said abrasive molding having a relative density of 20-70% and an average particle diameter of 0.001-50 &mgr;m. The abrasive molding preferably has pores having a pore size distribution such that the integrated pore volume of pores having a diameter of 0.01-1 &mgr;m is at least 20% of the integrated total pore volume of the entire pores, and the integrated pore volume of pores having a diameter of 1-360 &mgr;m is in the range of 10% to 70% of the integrated total pore volume of the entire pores. The abrasive molding is suitable for polishing a material having a Vickers hardness not larger than 300 kg/mm .


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