The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 10, 2003

Filed:

Jul. 17, 2002
Applicant:
Inventors:

Seiichi Watanabe, Tokyo, JP;

Kenji Shinozaki, Kanagawa, JP;

Minoru Kohno, Tokyo, JP;

Hiroyuki Mitsuhashi, Kanagawa, JP;

Minehiro Tonosaki, Kanagawa, JP;

Masato Kobayashi, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/400 ;
U.S. Cl.
CPC ...
C23C 1/400 ;
Abstract

A surface processing method for processing the surface of an insulating article in which an ion-implanted surface-modified layer is effectively formed on the article In surface processing the article of an insulating material, an electrically conductive thin metal film is first formed on the article surface. A pulsed voltage containing a positive pulsed voltage and a negative pulsed voltage is applied to the article in a plasma containing ions to be implanted to implant ions in the article surface. This implants ions at right angles to the article surface to generate a surface-modified layer There is no possibility of the article being charged up due to application of a pulsed voltage.


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