The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Nov. 15, 2000
L. William Dewey, III, Wappingers Falls, NY (US);
Peter A. Habitz, Hinesburg, VT (US);
Thomas G. Mitchell, Essex Junction, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A structure and method for extracting parasitic capacitance from a multi-layer wiring structure that creates, for each wiring layer in a wiring structure, a wiring density map and measures a plurality of metal segments in a wiring layer to determine an area occupied by the metal segments. The invention calculates an up area capacitance component for each of the metal segments by multiplying the area occupied by the metal segments by a wiring density from the wiring density map of an overlying wiring layer over the metal segments and by a capacitance coefficient of the overlying wiring layer. To calculate the down area capacitance component for each of the metal segments, the invention multiplies the area occupied by the metal segments by a wiring density, from the wiring density map of an underlying wiring layer under the metal segments and by a capacitance coefficient of the underlying wiring layer. The invention combines the up area capacitance component and the down area capacitance component to form a vertical coupling capacitance component for each of the metal segments.