The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Feb. 26, 2001
O-seob Jeon, Seoul, KR;
Gi-young Jeon, Bucheon, KR;
Seung-yong Choi, Seoul, KR;
Seung-won Lim, Anyang, KR;
Seung-jin Kim, Buchon, KR;
Eul-bin Im, Bucheon, KR;
Byeong Gon Kim, Buchon, KR;
Fairchild Korea Semiconductor Ltd., Kyungki-do, KR;
Abstract
A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.