The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Mar. 24, 2000
Koji Miyata, Yao, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A process for fabricating a resin-encapsulated semiconductor device comprises the steps of: (a) forming a plurality of first through holes for external connection in a substrate for mounting semiconductor chips; (b) forming a conductive film on a chip-mounting surface of the substrate and patterning the conductive film into a plurality of patterned wirings and a plurality of lands which cover the entire openings of the first through holes and partially constitute the patterned wirings; (c) mounting two or more semiconductor chips on the chip-mounting surface of the substrate; (d) mounting external connection terminals at the first through holes from a terminal-mounting surface opposite to the chip-mounting surface and connecting the semiconductor chips to the external terminals through the lands; (e) encapsulating the two or more semiconductor chips in one-piece with a resin encapsulant; (f) cutting the substrate with a first cutting blade from the terminal-mounting surface of the substrate; (g) cutting the resin encapsulant with a second cutting blade thinner than the first cutting blade; and (h) dividing the resulting substrate for the individual semiconductor chips.