The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 03, 2003

Filed:

Mar. 10, 1999
Applicant:
Inventors:

Kazutoshi Sakakibara, Aichi-gun, JP;

Takashi Nakashima, Aichi-gun, JP;

Minoru Kaneko, Aichi-gun, JP;

Masatoshi Harada, Aichi-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/10 ;
U.S. Cl.
CPC ...
C08K 3/10 ;
Abstract

An electroconductive resin composition which exhibits excellent moldability and electric conductivity, and is produced at low costs. The electroconductive resin composition contains a zinc-based metal powder, low melting metal which melts upon molding, and thermoplastic resin. The zinc-based metal powder having a large surface area captures the molten low melting metal to prevent the phase separation thereof from both the resin and zinc-based metal powder. The zinc-based metal powder has a round configuration, as compared to that of fiber so as not to damage the fluidity of the resin greatly. Thus, the resultant electroconductive resin composition is excellent in moldability, and can be produced at low costs.


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