The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2003
Filed:
Jul. 03, 2001
Shinichi Yajima, Tokyo, JP;
Fuji Jukogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
In the process for the monolithic molding of superplastic material, generation of wrinkles on the molded product can be prevented by avoiding local expansion generated in the no-bonding regions of both of three or more metal plates when the metal plates are monolithically molded by means of superplastic molding. The process is characterized in that auxiliary plates for molding are placed on both sides of the superposed plates through the no-bonding regions, these plates are set in the molding die, and a pressure lower than applied to the non-bonding regions is applied to spaces between inner wall of the molding die and the auxiliary plates to control movement of the top and bottom.