The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2003

Filed:

Jun. 27, 2001
Applicant:
Inventors:

Toru Yamada, Osaka, JP;

Kazuhide Uriu, Osaka, JP;

Tsutomu Matsumura, Osaka, JP;

Toshio Ishizaki, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/64 ; H03H 9/05 ; H01L 2/3053 ; H01L 2/315 ;
U.S. Cl.
CPC ...
H03H 9/64 ; H03H 9/05 ; H01L 2/3053 ; H01L 2/315 ;
Abstract

A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes. Also, a second ceramic layer has a second multilayer circuit pattern electrically connected through via holes. A thermosetting resin sheet is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer.


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