The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2003

Filed:

May. 30, 2002
Applicant:
Inventors:

Tetsuo Takeshima, Toyama, JP;

Manabu Sumita, Fukui-ken, JP;

Kiyotaka Tajima, Toyama, JP;

Yuichi Sakai, Toyama-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 4/1053 ;
U.S. Cl.
CPC ...
H01L 4/1053 ;
Abstract

A piezoelectric electroacoustic transducer includes a substantially square piezoelectric diaphragm flexually vibrating in a plate-thickness direction in response to application of an alternating signal between electrodes, a substantially rectangular insulating case having a supporting member disposed inside sidewalls of the case for supporting the diaphragm, terminals having internal connections exposed in a vicinity of the supporting member and external connections exposed outside the case and electrically connecting to the internal connections, a first adhesive applied to a shortest route located between the external periphery of the diaphragm and the internal connections and connecting the diaphragm to the internal connections so as to fix the diaphragm to the case, a conductive adhesive applied to electrodes of the diaphragm and the internal connections via the upper surface of the first adhesive by detouring from the shortest route to connect the diaphragm to the internal connections for electrically connecting the electrodes of the diaphragm to the internal connections of the terminals, and a second adhesive for sealing a clearance between the external periphery of the diaphragm and the internal periphery of the case. The first and second adhesives have a Young's modulus after curing smaller than that of the conductive adhesive.


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