The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2003

Filed:

Sep. 20, 2001
Applicant:
Inventors:

Yoshiteru Masaoka, Hyogo, JP;

Atsushi Fukunaga, Hyogo, JP;

Hiroshi Ando, Hyogo, JP;

Fumio Kawakubo, Hyogo, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 7/726 ;
U.S. Cl.
CPC ...
C08G 7/726 ;
Abstract

To provide curable resin compositions capable of exhibiting a low modulus, a high break strength, a high elongation and a satisfactory water-resistant adhesiveness to mortar. One of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, and (c) an epoxy group-substituted silane compound; and another of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, (c) an epoxy group-substituted silane compound, and (d) an epoxy resin.


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