The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Jul. 16, 1998
Takashi Fukusho, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method of manufacturing a solid-state image sensing device in which a light-sensitive sensor part for photoelectric transfer is formed on the surface of a substrate and a light shielding film for preventing light from being incident on the substrate except the light-sensitive sensor part is formed is provided. First, a transfer electrode is formed on the substrate via an insulating film and after an interlayer insulating film for covering the transfer electrode is further formed, a planarized film for covering the interlayer insulating film is formed. Next, only the location of the planarized film to be a light shielding area for forming a light shielding film is selectively etched, a concave portion is formed and a groove deep enough to reach the vicinity of the surface of the substrate is formed by etching the planarized film over the periphery of the light-sensitive sensor part and near the side of the transfer electrode. Afterward, the material of a light shielding film is embedded in the concave portion and inside the groove and a light shielding film is formed. The provision of the solid-state image sensing device and the manufacturing method in which the efficiency of condensing beams to the light-sensitive sensor part is enhanced and the sensitivity is enhanced is thus desired.