The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
May. 03, 2002
Laxminarayan Sharma, San Diego, CA (US);
Siamak Fazelpour, San Diego, CA (US);
Applied Micro Circuits Corporation, San Diego, CA (US);
Abstract
An electronic device package includes a modified ball grid array (“BGA”) interconnect substrate upon which a flip-chip device is mounted. The flip-chip device includes one or more high speed input/output solder bumps corresponding to input/output signals having data rates of up to 40 Gbps. A high speed solder bump is directly connected to an interconnect via formed within the BGA substrate, and the via is directly connected to a respective BGA solder ball positioned at an interior point of the BGA solder ball matrix. The BGA substrate is void of BGA solder balls between the designated high speed BGA solder ball and at least one edge of the substrate, thus providing a clear path to the designated high speed BGA solder ball for a high speed conductive trace formed on a printed circuit board.