The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Jul. 13, 2000
Applicant:
Inventors:
Nobutaka Shimizu, Kawasaki, JP;
Kazuyuki Imamura, Kawasaki, JP;
Atsushi Kikuchi, Kawasaki, JP;
Masaharu Minamizawa, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/312 ; H01L 2/310 ;
U.S. Cl.
CPC ...
H01L 2/312 ; H01L 2/310 ;
Abstract
A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than about 20 GPa and a thermal conductivity exceeding about 100 W/(m·K).
Shimizu, Nobutaka. (2003). Flip-chip semiconductor device having an improved reliability (U.S. Patent No. 6566748). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6566748
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile