The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Mar. 20, 2001
Applicant:
Inventors:
Shoshi Yasunaga, Kitakyushu, JP;
Jun Sugimoto, Kitakyushu, JP;
Assignee:
Mitsui High-tec, Inc., Fukuoka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A lead frame for a semiconductor device. The lead frame has a layer defining a first unit lead frame including a first support for a semiconductor chip and a plurality of leads spaced around the first support. The first support has a peripheral edge. The layer further defines a guide rail extending along at least a portion of the peripheral edge and connected to at least one of the leads. At least one notch is formed in the layer between the at least one lead and a part of the guide rail so as to define a first tie bar.