The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Oct. 19, 2000
Applicant:
Inventors:
Akitoshi Hara, Nagano-ken, JP;
Eiichi Sato, Okaya, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/146 ; H01L 2/130 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/146 ; H01L 2/130 ;
Abstract
After a silicon oxide film is formed on a semiconductor wafer, pattern formation alignment marks are provided in the chip formation areas and through-holes for stacking are formed in each chip formation area using an alignment mark as reference in order to improve accuracy in vertically stacking semiconductor chips. Next, after forming elements, wiring and electrode parts on the semiconductor wafer, the semiconductor wafer is cut along the chip formation area and is divided into semiconductor chips. Then, the divided semiconductor chips, as many as needed, are stacked by matching the through-holes.