The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Dec. 15, 2000
Toshiyuki Umehara, Osaka, JP;
Yoshimasa Sakata, Osaka, KP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A cured resin plate which is reduced in undulation and has excellent flatness even when having a thickness of 100 &mgr;m or larger or a size exceeding 2 inches; and a process for efficiently mass-producing the resin plate. The process comprises spreading a resinous coating fluid A on a support ( ) having a smooth surface to form an unsolidified or solidified coating layer, spreading thereon a resinous coating fluid B which is the same as or different from the coating fluid A to form two or more superposed layers of the coating fluid B, and solidifying the layers ( and ) separately or simultaneously to thereby form superposed resin layers ( and ) adhered to each other which comprise two or more adjacent cured resin layers ( and ). The multilayered resin plate comprises superposed layers adhered to each other which are composed of a thermoset epoxy resin layer and superposed thereon a thermoset epoxy resin layer having a smaller thickness than that layer. The multilayered resin plate can be continuously produced by the process in which resinous coating fluids are spread. The resin plate can be reduced in undulation because it comprises cured resin layers superposed on each other.