The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2003

Filed:

Apr. 21, 2000
Applicant:
Inventors:

Masafumi Harada, Nara, JP;

Takeji Hashimoto, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/16 ;
U.S. Cl.
CPC ...
B32B 5/16 ;
Abstract

A metal-organic polymer composite structure comprising a microphase-separated structure from a block copolymer composed of two or more polymer chains which are incompatible with each other bonded in an end-to-end manner, wherein one of the polymer phases of said microphase-separated structure selectively contains ultrafine metal particles arranged in a row or rows. A process for producing said metal-organic polymer composite structure, which comprises (i) the step of dissolving “metal ions” and “a block copolymer comprising one or more polymer chains having an affinity for the metal and, bonded thereto in an end-to-end manner, one or more polymer chains having no or little affinity for the metal” in a mixed solvent of “a high-boiling solvent having the ability to reduce the metal ion and having a boiling point of 80 to 200° C.” and “a low-boiling solvent having a boiling point of 10 to 80° C.”; (ii) the step of removing the low-boiling solvent at the boiling point thereof to cause the block copolymer to form a microphase-separated structure; and then (iii) the step of reducing the metal ions while removing the high-boiling solvent at the boiling point thereof.


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