The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
May. 07, 2001
Daniel A. Lawlyes, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A high density wirebond connector assembly ( ), is provided including an enclosure ( ), a circuit board ( ), a high density connector ( ), a connector housing ( ), and a plurality of pin contacts ( ). Every two rows of pin contacts ( ) merge onto a single shelf ( ) to provide a high density contact surface ( ). The circuit board ( ) is comprised of a plurality of laminate layers ( ) and rows of wirebond pads ( ) positioned on the laminate layers ( ). A plurality of wirebonds ( ) run between individual pin contacts ( ) and individual wirebond pads ( ). By creating a high density contact surface ( ) in combination with decreasing the distance between the wirebond pads ( ) and the pin contacts ( ), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly ( ) is provided.