The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2003

Filed:

May. 05, 2000
Applicant:
Inventors:

Masashi Shiraishi, Tokyo, JP;

Takeshi Wada, Tokyo, JP;

Mitsuyoshi Kawai, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/06 ; B23K 2/010 ;
U.S. Cl.
CPC ...
B23K 1/06 ; B23K 2/010 ;
Abstract

A method of manufacturing a head suspension assembly includes attaching underfill to a portion on which an IC chip with a circuit for a thin-film magnetic head element is to be mounted, disposing the IC chip on the attached underfill, and performing ultrasonic bonding of the IC chip.


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