The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2003

Filed:

Mar. 20, 2001
Applicant:
Inventors:

Kanako Imai, Kawasaki, JP;

Nobutaka Ito, Kawasaki, JP;

Fumihiko Ando, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/112 ; B23K 3/102 ; B23K 3/100 ; H01L 2/150 ;
U.S. Cl.
CPC ...
B23K 3/112 ; B23K 3/102 ; B23K 3/100 ; H01L 2/150 ;
Abstract

A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.


Find Patent Forward Citations

Loading…