The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6562704 B1

PDF
Full Text
Expired
Date of Patent:
May. 13, 2003

Filed:

Feb. 11, 2002
Applicant:
Inventor:

Yasuki Yoshihisa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1425 ;
U.S. Cl.
CPC ...
H01L 2/1425 ;
Abstract

After introducing an impurity into a polysilicon semiconductor film formed on a substrate, heat treatment is carried out under the conditions not to activate the implanted impurity. The thickness of the polysilicon film and the sheet resistance after introducing the impurity are measured, and the conditions of forming the semiconductor film are adjusted so that the product of the thickness and the sheet resistance is always constant.


Find Patent Forward Citations

Yoshihisa, Yasuki. (2003). Method for manufacturing semiconductor device, and semiconductor device (U.S. Patent No. 6562704). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6562704

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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