The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2003

Filed:

Sep. 07, 2000
Applicant:
Inventors:

Yoshiya Taniguchi, Akashi, JP;

Nobuyuki Hirayama, Tokyo, JP;

Yoshiaki Hara, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/577 ;
U.S. Cl.
CPC ...
B29C 4/577 ;
Abstract

A method of controlling a compression injection molding machine having a movable die mounted on a movable die plate including using a pressure sensor to detect a reaction force produced at the movable die by resin being injected into a die cavity. The pressure sensor is positioned between the movable die plate and a housing supporting a toggle driving mechanism that moves the movable die plate and movable die. The output of the sensor is applied to control the injection of the resin into the die cavity or the thickness of the resin. This output can also control gate cutting or resin injection speed.


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