The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2003

Filed:

Apr. 02, 2001
Applicant:
Inventors:

Masao Kamiguchi, Yamanashi, JP;

Tatsuhiro Uchiyama, Gotenba, JP;

Ikushi Takasaki, Kawasaki, JP;

Shusaku Nishiyama, Kawasaki, JP;

Katsuya Sakaba, Otsu, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 3/100 ;
U.S. Cl.
CPC ...
B29C 3/100 ;
Abstract

An injection is carried out under a certain molding condition with a nozzle in an injection molding machine left open to sample an injection pressure Pr in every certain cycle for storing. Detected pressure data Pr( ) to Pr(N) for one shot is stored as reference pressure data Pr ( ) to Pr (N). When defective molding occurs or when a resin lot is changed or the like, the injection is carried out with the nozzle left open under the same molding condition as that used in obtaining the reference pressure data to obtain the detected pressure data Pr( ) to Pr(N). Waveforms of the detected pressure data Pr( ) to Pr(N) and reference pressure data Pr ( ) to Pr (N) are graphically represented so that variation of the molding condition is observed. It is assumed that if there are any differences, a problem resides in the resin, while if there is no difference but the defective molding occurs, the problem resides in a mold.


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