The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2003
Filed:
Jan. 14, 1999
J. Kirston Henderson, Fort Worth, TX (US);
David L. Kellogg, Arlington, TX (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A system and method to measure physical conditions at an object under test. This system comprises at least one micro-electro mechanical die module placed proximate to the object under test. The micro-electro mechanical die module is formed on a substrate and consists of at least one micro-mechanical transducer to monitor physical conditions, a series of integrated circuits electrically connected to the micro-mechanical transducer in order to read the output of the transducer, an internal photo voltaic device located on the substrate, and a transmitter internal to the micro-electro mechanical die module connected to the integrated circuits and a first antenna. A second antenna gathers signals transmitted by the micro-electro mechanical die module. The micro-electro mechanical die module transmits a signal when the photo voltaic device is scanned by a coherent light source. A receiver electrically connected to the second antenna receives and amplifies the signals transmitted by the micro-electro mechanical die module. The signals transmitted by at least one micro-electro mechanical die module are received by the receiver and processed to obtain data representative of the physical conditions at the object under test from the signals.