The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2003
Filed:
Oct. 22, 2001
Yoshitsugu Uenishi, Ikoma, JP;
Tsuneshi Nakamura, Hirakata, JP;
Minoru Omori, Kyoto, JP;
Masashi Kadoya, Kyoto, JP;
Yoshihiro Higuchi, Otsu, JP;
Tsuyoshi Yoshino, Kameoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.