The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2003

Filed:

Apr. 19, 2001
Applicant:
Inventors:

Hermann Schmid, Schwaig, DE;

Wolfgang Ramin, Freising, DE;

Nusret Yilmaz, Freising, DE;

Heinrich Brenninger, Kranzberg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

In a device for attaching a semiconductor chip ( ) to a chip carrier ( ), thereby producing an electrically conducting connection between contact areas ( ) arranged on a surface of the semiconductor chip ( ) and contact areas ( ) on the chip carrier ( ) by means of an anisotropically conducting film ( ) or an anisotropically conducting paste ( ), a pressure die ( ) is used for the application of the pressure to the chip ( ) with an adjustable pressing force against the chip carrier ( ). A counter-pressure support ( ) accepts the chip carrier ( ) with the semiconductor chip ( ) arranged on it with the interposition of the anisotropically conducting film ( ) or the anisotropically conducting paste ( ). An elastic body ( ) is arranged either between the pressure die ( ) and the semiconductor chip ( ) or between the chip carrier ( ) and the counter-pressure support ( ).


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